Software for the global semiconductor surge - Arizona, Texas, Saxony (Silicon Saxony), Sriperumbudur, Hsinchu. CHIPS-Act-era greenfield fabs and brownfield expansion lines: fab automation, yield analytics, MES for chip packaging, SECS/GEM integration and AI-driven defect detection.
New US / EU fabs are commissioning hardware faster than the software ecosystem can keep up - fab automation and MES integration are the bottleneck.
Sub-1% yield improvement at advanced nodes equals tens of millions in revenue. AI-driven yield analytics on wafer-test data is non-optional.
Mixed-vendor fabs (ASML, AMAT, LAM, KLA, TEL) need a unified integration layer - not custom point-to-point spaghetti.
Manual SEM review is slow; AI / computer vision on wafer-test images cuts triage time by 80% and finds defects humans miss.
OSAT and advanced packaging (CoWoS, fan-out) need traceability and MES that the IC-design world never had to think about.
A 24-hour fab outage costs hundreds of millions. OT segmentation, anomaly detection and zero-trust access matter.
SECS/GEM (E5, E30, E40, E94) integration across ASML, AMAT, LAM, KLA, TEL and others. Unified data layer to MES and analytics platforms.
Wafer-map clustering, signature analysis, root-cause inference across hundreds of process steps. Explainable models with MLOps from day one.
Lot/wafer/die traceability across advanced packaging (CoWoS, fan-out, 2.5D / 3D), substrate handling and test floors.
Wafer-test image triage, SEM defect classification, packaging-line visual inspection. On-prem deployable with no cloud lock-in.
IEC 62443-aligned network segmentation, anomaly detection on industrial protocols, secure remote-engineer access - critical for SEMI E187-aware fabs.
Real-time OEE per tool, scheduled-PM optimization and digital twins of bottleneck modules for capacity planning.
AI defect-detection pilot on a wafer-test line - references available under NDA.
Yield analytics dashboards across packaging line - referenceable on a discovery call.
Production planning, yield analytics, barcode/RFID systems for the Foxconn-ecosystem manufacturing belt.
Published Samsung B2B case study demonstrating Ajinkya's electronics-grade engineering discipline.
Engagement structures designed for prime contractors and Tier-1 fab equipment vendors operating under CHIPS Act funding.
$1.4B+ inventory, $9.6B+ machinery and 27M tons of steel under our platforms today - fab-adjacent reliability discipline.
30-minute discovery call. We map your equipment, your MES, your yield-analytics gap and come back with two or three concrete options.
Yes. SECS/GEM (E5, E30, E40, E94) is core to our fab-automation work, and SEMI E187 cybersecurity guidance is baked into the OT cybersecurity playbook. We do not certify equipment - equipment vendors do that. We build the integration, MES and analytics layer that sits above.
CHIPS Act-funded engagements typically have specific local-content, security and audit requirements. We design engagement structures (direct, US-resident sub-contractor, joint venture) to match - talk to us about the specific prime / sub-contractor relationship and we will map it.
Yes. Fab IT estates rarely allow cloud-only - most of our fab engagements are on-prem or air-gapped with private-cloud for analytics. We do not lock you into any specific vendor.
We use cookies to make our site work and, with your consent, to measure traffic and improve the experience. You can change your choice anytime via "Cookie Settings" in the footer. Privacy Policy · Cookie Policy